ME PhD Thesis Defense- Corrisa Heyes

May 5, 10:30am - 11:30pm
Mānoa Campus, Holmes Hall 389

Abstract Micromechanical interlocking structures offer reusable, thermally robust, alignment-tolerant attachment through geometry rather than chemistry, providing a compelling alternative to solder joints and chemical adhesives for heterogeneous integration applications where substrate warpage and thermal-expansion mismatch demand compliance without irreversibility. This dissertation develops the framework and experimental infrastructure needed to identify a specific MIS geometry meeting these demands at stated parameters with quantified confidence. Three upstream physical characterizations (pre-contact adhesion modeling, misalignment sensitivity analysis, and macroscale pillar buckling) establish the physical and fabrication constraints that bound the candidate space as quantified design inputs. A large-format microscale testbed fabricated via multiphoton 3D lithography further characterizes resolution, geometric fidelity, and inter-structurespacing limits as active constraints. These inputs feed a three-level nested optimization framework applying geometric screening, fabrication regulation, and macroscale-analog performance evaluation to 540 specimens across 13 geometry families. The framework converges on a hemisphere-on-pillar geometry (Rxy= 7.5 渭m, Rz= 22.5 渭m, Dpillar = 10 渭m, Dheight= 24.75 渭m) with 99.2% robustness across the tested weight perturbation space. A class-level microscale realization is fabricated and characterized for geometric transfer fidelity, bounding the microscale force density estimate.


Event Sponsor
Mechanical Engineering, Mānoa Campus

More Information
Samantha Kawamoto, 8089567167, sk247@hawaii.edu, Thesis Defense Announcement (PDF)

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